The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Apr. 18, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Yutaka Takada, Minamiminowa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01P 1/02 (2006.01); G01P 15/08 (2006.01); G01C 19/5628 (2012.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); B81C 1/00253 (2013.01); G01C 19/5628 (2013.01); G01P 1/023 (2013.01); G01P 15/08 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01);
Abstract

A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.


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