The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

May. 01, 2014
Applicant:

The Boeing Company, Chicago, IL (US);

Inventor:

Eugene Dan-Jumbo, Bothell, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 73/00 (2006.01); B32B 43/00 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B29C 70/54 (2006.01); B29C 73/02 (2006.01); B29C 73/14 (2006.01); B29C 70/44 (2006.01); B29C 65/48 (2006.01); B29C 65/54 (2006.01); B29C 73/30 (2006.01);
U.S. Cl.
CPC ...
B32B 37/0023 (2013.01); B29C 70/443 (2013.01); B29C 70/545 (2013.01); B29C 70/546 (2013.01); B29C 73/025 (2013.01); B29C 73/14 (2013.01); B29C 65/48 (2013.01); B29C 65/542 (2013.01); B29C 65/544 (2013.01); B29C 66/71 (2013.01); B29C 73/30 (2013.01);
Abstract

A system for repair of damaged holes in composite structures incorporates a repair system tool device having a sleeve sized to be closely received in a hole in a composite structure. The sleeve has a central bore for receiving parent resin and an array of orifices for radial expulsion of the parent resin into the hole. A caul plate seals the central bore and a vacuum bag covering the caul plate is sealed to the surface of the composite structure. Introduction of vacuum in the vacuum bag provides a differential pressure for infusion of resin from the orifices in the sleeve into delaminations extending from the hole.


Find Patent Forward Citations

Loading…