The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Sep. 06, 2011
Applicants:

Koichi Yamashita, Koga, JP;

Shigehiro Kanou, Koga, JP;

Masami Nishikawa, Koga, JP;

Kaoru Yaguchi, Koga, JP;

Fumihito Tonomura, Koga, JP;

Inventors:

Koichi Yamashita, Koga, JP;

Shigehiro Kanou, Koga, JP;

Masami Nishikawa, Koga, JP;

Kaoru Yaguchi, Koga, JP;

Fumihito Tonomura, Koga, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B32B 3/30 (2006.01); B29C 37/00 (2006.01); B29C 45/37 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B29D 7/01 (2006.01); B32B 3/26 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14827 (2013.01); B29C 37/0032 (2013.01); B29C 37/0053 (2013.01); B29C 45/372 (2013.01); B29D 7/01 (2013.01); B32B 3/263 (2013.01); B32B 3/30 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B29C 2035/085 (2013.01); B29C 2035/0827 (2013.01); B29C 2035/0833 (2013.01); B29C 2035/0877 (2013.01); B29C 2037/0042 (2013.01); B29C 2037/0046 (2013.01); B32B 2451/00 (2013.01); Y10T 428/24355 (2015.01); Y10T 428/24479 (2015.01);
Abstract

Provided are a decorative resin sheet that sufficiently brings together embossing property and embossment-retaining property, and a molded resin article on which an embossment excellent in design is formed and a method of manufacturing the molded resin article. The method of manufacturing a molded resin article includes the steps of: providing a resin sheet having a mold layer containing a polyolefin-based resin as a main component, followed by formation of an embossment on the resin sheet so that the embossment is formed on a surface of the mold layer; crosslinking the mold layer on which the embossment is formed so that a 100% modulus of the resin sheet at 200° C. becomes 0.02 MPa or more, which is measured in conformity with JIS K6251 (2004 version); placing the resultant resin sheet () in an injection molding die () so that the surface () of the mold layer faces a side from which a molten resin () is injected; injecting the molten resin () onto a side of the surface () of the mold layer in the injection molding die () to mold a molded resin article; and separating the molded resin article and the mold layer.


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