The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Feb. 21, 2012
Kenichi Ueda, Osaka, JP;
Mitsushi Sogabe, Osaka, JP;
Kenichi Ueda, Osaka, JP;
Mitsushi Sogabe, Osaka, JP;
TANAZAWA HAKKOSHA CO., LTD., Osaka, JP;
Abstract
A molding die includes a die having a mold plane; and gloss control granules composed of 50 to 80 pbw of a shape retention fixation base material such as a thermosetting resin; 30 to 80 pbw of a diffuse reflecting surface formation core material such as a ceramic powder; and 5 to 10 pbw of a roughness enhancement material such as an inorganic fiber, adhered to the mold plane in a spaced-apart manner. The gloss control granules are each independently adhered in the spaced-apart manner to form gloss control projections on the mold plane of the die so that a surface of a molded product molded on the die forms a surface having a small specular reflection or a diffuse reflection, and the gloss control projections having fine, uneven surfaces with recesses and projections are formed on the mold plane at a coating rate of 40 to 80%.