The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Dec. 02, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Sukgyu Hahm, Gyeongju-si, KR;
Dongouk Kim, Pyeongtaek-si, KR;
Joonyong Park, Suwon-si, KR;
Jihyun Bae, Seoul, KR;
Bongsu Shin, Seoul, KR;
Sunghoon Lee, Seoul, KR;
Hongseok Lee, Seongnam-si, KR;
Jaeseung Chung, Seoul, KR;
Abstract
A method of manufacturing a master mold includes forming a plurality of replica resin layers using a mold; forming a replica template by bonding the plurality of replica resin layers on a template; forming a replica mold layer having a pattern corresponding to a pattern of the plurality of replica resin layers using the replica template; forming a flexible stamp having a pattern formed on a surface thereof using the replica mold layer; transferring the pattern formed on the surface of the flexible stamp to a mold resin; and forming a large area master mold by etching a surface of a substrate based on a pattern shape of the mold resin.