The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Jun. 11, 2012
Applicants:
Hiromi Yokota, Aichi, JP;
Ryo Mukai, Aichi, JP;
Shinichi Kato, Aichi, JP;
Nahomi Hamaguchi, Aichi, JP;
Inventors:
Hiromi Yokota, Aichi, JP;
Ryo Mukai, Aichi, JP;
Shinichi Kato, Aichi, JP;
Nahomi Hamaguchi, Aichi, JP;
Assignee:
Taiho Kogyo Co., Ltd., Toyota-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 7/08 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); F16C 33/12 (2006.01); C22C 9/04 (2006.01); C22C 9/08 (2006.01);
U.S. Cl.
CPC ...
B22F 7/08 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 9/08 (2013.01); F16C 33/121 (2013.01); B22F 2998/00 (2013.01); F16C 2204/12 (2013.01); Y02T 10/865 (2013.01);
Abstract
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of FeP, FeP, FeB, NiB and AlN may be added.