The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Jun. 15, 2012
Takeshi Tokuyama, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Ryuichi Saito, Hitachinaka, JP;
Toshiya Satoh, Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Takeshi Tokuyama, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Ryuichi Saito, Hitachinaka, JP;
Toshiya Satoh, Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.