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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9433098 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Jan. 23, 2013

Method of manufacturing a combined circuit board

Applicant:

Mutual-tek Industries Co., Ltd., Xinzhuang, TW;

Inventors:

Shi Yu Chiou, New Taipei, TW;

Hsu-Tung Chen, New Taipei, TW;

Assignee:

Mutual-Tek Industries Co., Ltd., Taipei County, Xinzhuang, TW;

Attorney:

Snell & Wilmer L.L.P.

Primary Examiner:

Linda L Gray

Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/46 (2006.01); B32B 37/02 (2006.01); B32B 37/18 (2006.01); B32B 38/10 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0064 (2013.01); H05K 3/4691 (2013.01); B32B 37/02 (2013.01); B32B 37/144 (2013.01); B32B 37/18 (2013.01); B32B 38/10 (2013.01); H05K 1/0278 (2013.01); H05K 3/0052 (2013.01); H05K 3/365 (2013.01); H05K 2201/0909 (2013.01); Y10T 156/1056 (2015.01); Y10T 225/307 (2015.04); Y10T 225/321 (2015.04); Y10T 225/325 (2015.04);
Abstract

A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR) and a predetermined reserved region (PRR) according to the arrangement of the TPs. Next, a conductive bonding layer (CBL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs. Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRRis bent at the TPs relative to the PRR. Finally, part of the RS located at the PRRand part of the CBL corresponding to the PRRare removed to form an indentation to expose part of the FCB.

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