The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Dec. 03, 2015
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Jong-Wen Chwu, New Taipei, TW;

Chao-Cheng Lin, Keelung, TW;

Che-Yao Wu, Changhua County, TW;

Yu-Chen Liu, Hsinchu, TW;

Wei-Chieh Yang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); H01L 27/32 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3248 (2013.01); G02F 1/1368 (2013.01); G02F 1/133305 (2013.01); G02F 1/136286 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); B32B 2457/20 (2013.01);
Abstract

A first etching stop layer and an active layer are formed on an inner surface of a first glass substrate, and a second etching stop layer and a cover layer are formed on an inner surface of a second glass substrate. A display media is formed between the first glass substrate and the second glass substrate. A first passivation layer is formed on an outer surface of the second glass substrate. A first etching process is performed to expose the first etching stop layer. A first flexible substrate is formed on the exposed first etching stop layer, and a second passivation layer is formed on the first flexible substrate. The first passivsation layer is removed. A second etching process is performed to expose the second etching stop layer. A second flexible substrate is formed on the exposed second etching stop layer, and the second passivation layer is removed.


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