logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431375 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Mar. 29, 2012

High density microelectronics packaging

Applicants:

Harmel Jean Defretin, Sugar Land, TX (US);

Tao Xu, Houston, TX (US);

Glenn Gardner, Cypress, TX (US);

Inventors:

Harmel Jean Defretin, Sugar Land, TX (US);

Tao Xu, Houston, TX (US);

Glenn Gardner, Cypress, TX (US);

Assignee:

SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);

Attorney:

John Vereb

Primary Examiner:

Meiya Li

Assistant Examiner:

Peter M Albrecht

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 25/07 (2006.01); H01L 23/10 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/053 (2006.01); H01L 21/66 (2006.01); H01L 23/06 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 25/04 (2014.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/071 (2013.01); H01L 22/10 (2013.01); H01L 23/053 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01L 24/73 (2013.01); H01L 25/04 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract

Example packaging of microelectronics and example methods of manufacturing the same are provided herein. The packaging can enable and/or improve the use of the microelectronics in a downhole, high temperature and/or high pressure setting. The microelectronics packaging can include double-sided active components, heat sinks, and/or three-dimensional stacking of dies.

Find Patent Forward Citations

Defretin, Harmel. (2016). High density microelectronics packaging (U.S. Patent No. 9431375). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9431375

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…