The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Nov. 25, 2014
Applicant:
Automated Assembly Corporation, Lakeville, MN (US);
Inventors:
Scott Lindblad, Lakeville, MN (US);
David Neuman, Randolph, MN (US);
Robert Neuman, Cannon Falls, MN (US);
Assignee:
Automated Assembly Corporation, Lakeville, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/30 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/46 (2013.01); H01L 24/85 (2013.01); H01L 2224/494 (2013.01); H01L 2224/4905 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01);
Abstract
A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.