The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Sep. 10, 2013
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventors:
Atsuko Sakata, Yokkaichi, JP;
Masayuki Kitamura, Yokkaichi, JP;
Makoto Wada, Yokohama, JP;
Masayuki Katagiri, Kawasaki, JP;
Yuichi Yamazaki, Inagi, JP;
Akihiro Kajita, Yokkaichi, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53276 (2013.01); H01L 21/7685 (2013.01); H01L 21/76805 (2013.01); H01L 21/76849 (2013.01); H01L 21/76852 (2013.01); H01L 23/53238 (2013.01); H01L 23/53257 (2013.01); H01L 23/5283 (2013.01); H01L 2924/0002 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a metal interconnect and a graphene interconnect which are stacked to one another.