The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Feb. 03, 2016
Nantong Fujitsu Microelectronics Co., Ltd., Nantong, CN;
Chang-Ming Lin, Nantong, CN;
Yu-Juan Tao, Nantong, CN;
NANTONG FUJITSU MICROELECTRONICS CO., LTD., Nantong, CN;
Abstract
A semiconductor packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a first surface and a second surface, and an electroplating seed layer on the first surface of the semiconductor substrate. The method also includes forming a plurality of columnar electrodes over the electroplating seed layer, where the columnar electrodes include first columnar electrodes and second columnar electrodes. Further, the method includes forming a diffusion barrier layer over the first columnar electrodes and the second columnar electrodes, forming a plurality of first solder balls over the diffusion barrier layer on the first columnar electrodes. The method also includes providing a packaging substrate having solder terminals corresponding to the first solder balls, and mounting the semiconductor substrate onto the packaging substrate in a flipped position, such that the first solder balls are connected with the solder terminals.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile