The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Jun. 17, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Seiji Morino, Nagoya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/49844 (2013.01); H05K 7/209 (2013.01); H01L 23/4006 (2013.01); H01L 23/49562 (2013.01); H01L 23/49861 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2023/4062 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink.


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Morino, Seiji. (2016). Electronic device (U.S. Patent No. 9431318). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9431318

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