The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Nov. 07, 2013
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Yongguo Chen, Shanghai, CN;

Hujiao Wang, Shanghai, CN;

David A. Holtzclaw, Cumming, GA (US);

Wei Qi, Shanghai, CN;

Benjamin Lee Davis, Lawrenceville, GA (US);

John MacKay, Lawrenceville, GA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/40 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/13 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4068 (2013.01); H01L 2924/0002 (2013.01);
Abstract

In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.


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