The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Mar. 03, 2011
Applicants:
Tetsuya Enomoto, Tsukuba, JP;
Emi Miyazawa, Tsukuba, JP;
Kazutaka Honda, Tsukuba, JP;
Akira Nagai, Tsukuba, JP;
Keisuke Ookubo, Tsukuba, JP;
Inventors:
Tetsuya Enomoto, Tsukuba, JP;
Emi Miyazawa, Tsukuba, JP;
Kazutaka Honda, Tsukuba, JP;
Akira Nagai, Tsukuba, JP;
Keisuke Ookubo, Tsukuba, JP;
Assignee:
Hitachi Chemical Company, LTD, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 59/42 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.