The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Aug. 18, 2008
Applicants:

Wolfgang Aderhold, Cupertino, CA (US);

Sundar Ramamurthy, Fremont, CA (US);

Aaron Hunter, Santa Cruz, CA (US);

Inventors:

Wolfgang Aderhold, Cupertino, CA (US);

Sundar Ramamurthy, Fremont, CA (US);

Aaron Hunter, Santa Cruz, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27B 5/14 (2006.01); F26B 19/00 (2006.01); H01L 21/67 (2006.01); F27B 17/00 (2006.01); F27D 19/00 (2006.01); F27D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); F27B 17/0025 (2013.01); F27D 19/00 (2013.01); F27D 21/0014 (2013.01);
Abstract

Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector.


Find Patent Forward Citations

Loading…