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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431273 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Dec. 07, 2015

Method for manufacturing a resin-encapsulated semiconductor device

Applicant:

Seiko Instruments Inc., Chiba-shi, Chiba, JP;

Inventor:

Noriyuki Kimura, Chiba, JP;

Assignee:

SII SEMICONDUCTOR CORPORATION, , JP;

Attorney:

Adams & Wilks

Primary Examiner:

Khiem D Nguyen

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49582 (2013.01); H01L 24/89 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions arranged so that leading end portions thereof are opposed to the die pad portion, and thin metal wires for connecting together electrodes of the semiconductor element and the lead portions. Those members are partially encapsulated by a resin. A bottom surface part of the die pad portion and a lead bottom surface part, an outer surface part, and an upper end part of the lead portion are exposed from the encapsulation resin. After a cutout part devoid of the encapsulation resin is formed above a lead upper end part, a plating layer is formed on the lead bottom surface part and the lead upper end part.

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