The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
May. 21, 2015
Asm Ip Holding B.v., Almere, NL;
Bert Jongbloed, Oud-Heverlee, BE;
Dieter Pierreux, Dilbeek, BE;
Cornelius A. van der Jeugd, Heverlee, BE;
Herbert Terhorst, Amersfoort, NL;
Lucian Jdira, Nieuw Vennep, NL;
Radko G. Bankras, Almere, NL;
Theodorus G. M. Oosterlaken, Oudewater, NL;
ASM IP HOLDING B.V., , NL;
Abstract
In some embodiments, a reactive curing process may be performed by exposing a semiconductor substrate in a process chamber to an ambient containing hydrogen peroxide, with the pressure in the process chamber at about 300 Torr or less. In some embodiments, the residence time of hydrogen peroxide molecules in the process chamber is about five minutes or less. The curing process temperature may be set at about 500° C. or less. The curing process may be applied to cure flowable dielectric materials and may provide highly uniform curing results, such as across a batch of semiconductor substrates cured in a batch process chamber.