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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431171 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Oct. 05, 2012

Method for molding powder mold product

Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Sintered Alloy, Ltd., Okayama, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Autonetworks Technologies, Ltd., Mie, JP;

Inventors:

Kazushi Kusawake, Itami, JP;

Atsushi Sato, Itami, JP;

Masato Uozumi, Itami, JP;

Koji Yamaguchi, Osaka, JP;

Assignees:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Sumitomo Electric Sintered Alloy, Ltd., Takahashi-shi, JP;

Attorneys:

Venable LLP

Michael A. Sartori

Trent B. Ostler

Primary Examiner:

Mary F Theisen

Int. Cl.
CPC ...
H01F 1/24 (2006.01); B30B 15/00 (2006.01); H01F 41/00 (2006.01); B22F 3/02 (2006.01); H01F 41/02 (2006.01); B22F 3/03 (2006.01); H01F 1/33 (2006.01);
U.S. Cl.
CPC ...
H01F 41/00 (2013.01); B22F 3/02 (2013.01); B30B 15/0011 (2013.01); H01F 1/24 (2013.01); H01F 41/0246 (2013.01); B22F 3/03 (2013.01); B22F 2003/026 (2013.01); H01F 1/33 (2013.01);
Abstract

The present invention relates to a method for molding a powder mold product according to which a powder mold product of uniform quality can be molded with excellent productivity. The present invention includes the steps of: preparing raw material powder(a preparing step); interposing a mold assembly-use lubricant between an outer circumferential faceof a first punch (a lower punch) and an inner circumferential faceof a die, the lower punchand the diein this state being relatively shifted to apply the mold assembly-use lubricant to the inner circumferential faceof the die(an applying step); and packing the raw material powderinto a cavity, a powder mold productbeing molded by the raw material powderbeing pressed (a molding step). In the applying step, while the mold assembly-use lubricant is discharged from a supply portprovided to the lower punchand the discharged mold assembly-use lubricant is collected from a drain portprovided to the lower punch, the mold assembly-use lubricant is applied to the inner circumferential faceof the die

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