The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Feb. 25, 2013
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Toru Takayama, Kanagawa, JP;

Junya Maruyama, Kanagawa, JP;

Yuugo Goto, Kanagawa, JP;

Yumiko Ohno, Kanagawa, JP;

Yasuyuki Arai, Kanagawa, JP;

Noriko Shibata, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); G02F 1/1345 (2006.01); H01L 21/20 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); H01L 21/76251 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 27/15 (2013.01); G02F 1/13454 (2013.01); G02F 2001/13456 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/3025 (2013.01);
Abstract

The present invention intends to realize a narrow flame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.


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