The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Nov. 10, 2015
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Yoshiaki Ishigami, Hitachi, JP;

Kinya Yamazaki, Hitachi, JP;

Yoshinori Sunaga, Hitachinaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4268 (2013.01); G02B 6/4219 (2013.01); G02B 6/4236 (2013.01); G02B 6/4269 (2013.01); G02B 6/4292 (2013.01); G02B 6/4295 (2013.01); G02B 6/423 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01);
Abstract

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.


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