The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Nov. 18, 2011
Applicants:

I-shih Tseng, Taoyuan Hsien, TW;

Tien-teng Chang, Taoyuan Hsien, TW;

Jeff Lee, Taoyuan Hsien, TW;

Chih-yu Cheng, Taoyuan Hsien, TW;

Hsu-ting Cheng, Taoyuan Hsien, TW;

Inventors:

I-Shih Tseng, Taoyuan Hsien, TW;

Tien-Teng Chang, Taoyuan Hsien, TW;

Jeff Lee, Taoyuan Hsien, TW;

Chih-Yu Cheng, Taoyuan Hsien, TW;

Hsu-Ting Cheng, Taoyuan Hsien, TW;

Assignee:

CHROMA ATE INC., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2635 (2013.01); G01R 1/0408 (2013.01);
Abstract

A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.


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