The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Apr. 20, 2012
Michael F. Taras, Fayetteville, NY (US);
Keonwoo Lee, Manlius, NY (US);
Mark J. Perkovich, Fayetteville, NY (US);
Suresh Duraisamy, Liverpool, NY (US);
Xuqiang Liao, Manlius, NY (US);
Claus E. Jorgensen, Egernsund, DK;
Arne F. Hansen, Graasten, DK;
Michael F. Taras, Fayetteville, NY (US);
KeonWoo Lee, Manlius, NY (US);
Mark J. Perkovich, Fayetteville, NY (US);
Suresh Duraisamy, Liverpool, NY (US);
XuQiang Liao, Manlius, NY (US);
Claus E. Jorgensen, Egernsund, DK;
Arne F. Hansen, Graasten, DK;
CARRIER CORPORATION, Farmington, CT (US);
Abstract
A heat sink assembly is disclosed for cooling a power electronics module, such as a variable frequency drive. The heat sink assembly includes a housing and a heat sink structure. The housing defines an interior chamber for enclosing the power electronics module and also defines a cooling air flow channel exterior to the interior chamber. The heat sink structure is disposed in conductive heat transfer relationship with the interior chamber and has a heat transfer surface positioned within the exterior cooling air flow channel in convective heat transfer relationship with the cooling air flow.