The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Feb. 10, 2015
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Shuichi Ichikawa, Nagoya, JP;

Keisuke Kimura, Nagoya, JP;

Taku Nishigaki, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D 46/24 (2006.01); C04B 38/00 (2006.01); F01N 3/022 (2006.01); B32B 3/12 (2006.01); C04B 28/24 (2006.01); C04B 35/565 (2006.01); C04B 35/63 (2006.01); C04B 111/00 (2006.01); C04B 111/20 (2006.01);
U.S. Cl.
CPC ...
F01N 3/0222 (2013.01); B01D 46/2418 (2013.01); B01D 46/2448 (2013.01); B01D 46/2466 (2013.01); B32B 3/12 (2013.01); C04B 28/24 (2013.01); C04B 35/565 (2013.01); C04B 35/6316 (2013.01); C04B 38/0006 (2013.01); C04B 2111/0081 (2013.01); C04B 2111/00387 (2013.01); C04B 2111/00793 (2013.01); C04B 2111/2084 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/428 (2013.01); C04B 2235/5224 (2013.01); Y10T 428/24149 (2015.01);
Abstract

In a honeycomb structure, a bonding material monolithically bonds a plurality of honeycomb segments. The bonding material contains crystalline anisotropic ceramic particle and a particulate pore former. The crystalline anisotropic ceramic particle is 20 mass % or less. An average particle diameter of the pore former in the bonding material is 80 to 200 μm. In the case where a compressive Young's modulus of the bonding material is assumed as E (unit: MPa) and a shear strength of the bonding material is assumed as σ (unit: kPa), σ/E is 5 to 50.


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