The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Oct. 30, 2012
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Takeshi Ezura, Tokyo, JP;
Akitoshi Suzuki, Tokyo, JP;
Kensaku Shinozaki, Tokyo, JP;
Hirokazu Sasaki, Tokyo, JP;
Satoshi Yamazaki, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/58 (2006.01); C25D 7/06 (2006.01); C25D 1/04 (2006.01); H05K 1/09 (2006.01); C25D 3/38 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C25D 7/0614 (2013.01); C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); H05K 1/09 (2013.01); H05K 1/0393 (2013.01); H05K 3/022 (2013.01);
Abstract
Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.
Ezura, Takeshi. (2016). High strength, high heat resistance electrodeposited copper foil and manufacturing method for same (U.S. Patent No. 9428840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9428840
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile