The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Apr. 09, 2014
Applicants:

Guoqiang LI, Baton Rouge, LA (US);

Harper Meng, Baton Rouge, LA (US);

Inventors:

Guoqiang Li, Baton Rouge, LA (US);

Harper Meng, Baton Rouge, LA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/04 (2006.01); B29C 73/18 (2006.01); C04B 26/16 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C08G 18/42 (2006.01); D01F 6/70 (2006.01); C04B 26/04 (2006.01); C04B 26/26 (2006.01); C04B 28/02 (2006.01); C04B 20/10 (2006.01); C08G 101/00 (2006.01); C04B 103/00 (2006.01); C04B 111/00 (2006.01); C04B 111/72 (2006.01);
U.S. Cl.
CPC ...
C08L 75/04 (2013.01); B29C 73/18 (2013.01); C04B 20/1037 (2013.01); C04B 26/04 (2013.01); C04B 26/16 (2013.01); C04B 26/26 (2013.01); C04B 28/02 (2013.01); C08G 18/4238 (2013.01); C08G 18/664 (2013.01); C08G 18/7671 (2013.01); D01F 6/70 (2013.01); C04B 2103/0065 (2013.01); C04B 2111/00612 (2013.01); C04B 2111/72 (2013.01); C08G 2101/0025 (2013.01); C08G 2280/00 (2013.01); C08G 2350/00 (2013.01);
Abstract

A composition comprising thermoset polymer, shape memory polymer to facilitate macro scale damage closure, and a thermoplastic polymer for molecular scale healing is disclosed; the composition has the ability to resolve structural defects by a bio-mimetic close-then heal process. In use, the shape memory polymer serves to bring surfaces of a structural defect into approximation, whereafter use of the thermoplastic polymer for molecular scale healing allowed for movement of the thermoplastic polymer into the defect and thus obtain molecular scale healing. The thermoplastic can be fibers, particles or spheres which are used by heating to a level at or above the thermoplastic's melting point, then cooling of the composition below the melting temperature of the thermoplastic. Compositions of the invention have the ability to not only close macroscopic defects, but also to do so repeatedly even if another wound/damage occurs in a previously healed/repaired area.


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