The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Jan. 12, 2015
Applicant:

Toyo Seikan Group Holdings, Ltd., Tokyo, JP;

Inventors:

Yoshihiro Ohta, Yokohama-shi, JP;

Yoichi Ishizaki, Yokohama, JP;

Yui Asano, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 167/02 (2006.01); B65D 81/26 (2006.01); C08G 63/183 (2006.01); C08G 63/54 (2006.01); C09J 167/06 (2006.01); B01J 20/26 (2006.01); B32B 15/09 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
B65D 81/266 (2013.01); B01J 20/264 (2013.01); B32B 7/12 (2013.01); B32B 15/09 (2013.01); C08G 63/183 (2013.01); C08G 63/54 (2013.01); C09J 167/02 (2013.01); C09J 167/06 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/74 (2013.01); Y10T 428/31794 (2015.04);
Abstract

A two-component curable oxygen-absorbing composition comprises a polyester comprising structural units derived from an acid component (A) and an acid component (B), wherein the ratio of the acid component (A) to total acid components is 70 mol % to 95 mol %, the ratio of the acid component (B) to total acid components is 0 mol % to 15 mol %, the polyester has a glass transition temperature of −20° C. to 0° C., the resin is cured using a diisocyanate hardening agent, and the acid component (A) is a tetrahydrophthalic acid or a derivative thereof, or a tetrahydrophthalic acid anhydride or a derivative thereof, and the acid component (B) is a phthalic acid or an analog thereof.


Find Patent Forward Citations

Loading…