The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Dec. 18, 2012
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Hubert Moriceau, Saint-Egreve, FR;

Maxime Argoud, Lyons, FR;

Frank Fournel, Villard-Bonnot, FR;

Frederic Mazen, Grenoble, FR;

Christophe Morales, St Pierre de Mesage, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/165 (2006.01); B44C 1/17 (2006.01); B29C 65/52 (2006.01); B32B 37/14 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); H01L 21/762 (2006.01); B32B 3/02 (2006.01); B32B 7/02 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); B32B 3/02 (2013.01); B32B 7/02 (2013.01); H01L 21/76254 (2013.01); Y10T 428/21 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01);
Abstract

A method for manufacturing a flexible structure including implanting ionic species in first and second source substrates so as to form first and second embrittlement regions respectively, delimiting first and second thin films, providing a flexible substrate, the stiffness R of which is less than or equal to 10GPa·μm, securing the first and second thin films to the first and second faces of the flexible substrate respectively so as to form a stack including the flexible structure delimited by the first and second embrittlement regions, the flexible structure having a stiffening effect suitable for allowing transfers of the first and second thin films, and applying a thermal budget so as to transfer the first and second thin films onto the flexible substrate.


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