The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Nov. 19, 2013
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Rudolf J. Koopmans, Einsiedeln, CH;

Luis G. Zalamea Bustillo, Richterswil, CH;

Karl Zuercher, Samstagern, CH;

Thomas T. Allgeuer, Wollerau, CH;

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); B32B 5/18 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 7/14 (2006.01); C09J 7/02 (2006.01); B32B 27/32 (2006.01); C08K 9/02 (2006.01); C08L 23/04 (2006.01); C09K 3/10 (2006.01);
U.S. Cl.
CPC ...
B32B 7/02 (2013.01); B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 27/065 (2013.01); B32B 27/32 (2013.01); C08K 9/02 (2013.01); C09J 7/0242 (2013.01); C09J 7/0275 (2013.01); B32B 2250/242 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2266/0214 (2013.01); B32B 2307/304 (2013.01); B32B 2553/00 (2013.01); C08K 2201/01 (2013.01); C08L 23/04 (2013.01); C09J 2423/046 (2013.01); C09K 3/1006 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24942 (2015.01);
Abstract

A multi-layered structure comprising an induction activation layer comprising a blend of (a) a first thermoplastic polymer, (b) a plurality of first particles, each said first particle comprising (i) a core comprising one or more magnetic materials and (ii) a shell comprising silicon dioxide; and (c) optionally a plurality of second particles, each said second particle comprising heat conducting particles; and a sealant, wherein the sealant exhibits a melting point equal to or lower than any other layer in the multi-layered structure, wherein the induction activation layer and sealant are in direct or indirect thermal contact is provided.


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