The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Mar. 09, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Miho Ishii, Kawasaki, JP;

Ken Ikegame, Ebina, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B29C 33/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/0061 (2013.01); B41J 2/1404 (2013.01); B41J 2/1603 (2013.01); B41J 2/1606 (2013.01); B41J 2/1631 (2013.01); B41J 2/1639 (2013.01); B41J 2/1645 (2013.01); G03F 7/00 (2013.01);
Abstract

A manufacturing method for a liquid ejection head including: a substrate; an ejection orifice forming member having an ejection orifice on the substrate; and a surface layer having a recess that has a bottom portion communicating with the ejection orifice and an opening held in contact with an outside and having a width larger than a width of the ejection orifice, the surface layer being formed on the forming member, the method including: forming a first resin layer serving as the forming member by applying a negative photosensitive resin composition A onto the substrate; forming a second resin layer as the surface layer by applying a negative photosensitive resin composition B having sensitivity lower than sensitivity of the composition A onto the first resin layer; subjecting the first and the second resin layers to pattern exposure collectively; and subjecting the first and the second resin layers to development collectively.


Find Patent Forward Citations

Loading…