The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

May. 15, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Daisuke Sato, Tochigi, JP;

Junichi Nishimura, Tochigi, JP;

Ryosuke Odaka, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); C09J 7/02 (2006.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01); C08K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); C09J 7/0203 (2013.01); C09J 163/00 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H05K 3/305 (2013.01); C08K 3/0008 (2013.01); C09J 2201/134 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); H01L 2224/29 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29366 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83194 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15788 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); Y02P 70/613 (2015.11); Y10T 428/28 (2015.01); Y10T 428/2848 (2015.01);
Abstract

To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.


Find Patent Forward Citations

Loading…