The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jan. 08, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Saujit Bandhu, Singapore, SG;

YunLong Qiao, Singapore, SG;

Vincent Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01R 12/00 (2006.01); H01R 12/72 (2011.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); H01R 12/721 (2013.01); H05K 1/0228 (2013.01); H05K 1/111 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A substrate comprises a first plurality of conductive pads disposed on a first side of the substrate and a different second plurality of conductive pads disposed on the first side of the substrate. Each conductive pad in the first plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSAS plug connector when the MicroSAS plug connector is mounted onto the substrate. Each conductive pad in the second plurality of conductive pads is configured to make electrical contact with a corresponding contact of a MicroSATA plug connector when the MicroSATA plug connector is mounted onto the substrate. At least one conductive pad belongs to both the first and second pluralities of conductive pads.


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