The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jan. 30, 2015
Applicant:

Arkansas Power Electronics International, Inc., Fayetteville, AR (US);

Inventors:

Brice McPherson, Fayetteville, AR (US);

Peter D. Killeen, Fayetteville, AR (US);

Alex Lostetter, Fayetteville, AR (US);

Robert Shaw, Fayetteville, AR (US);

Brandon Passmore, Fayetteville, AR (US);

Jared Hornberger, Springdale, AR (US);

Tony M. Berry, Springdale, AR (US);

Assignee:

Cree Fayetteville, Inc., Fayetteville, AR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 23/049 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01L 23/049 (2013.01); H01L 23/3735 (2013.01); H01L 25/07 (2013.01); H01L 23/15 (2013.01); H01L 23/49861 (2013.01);
Abstract

A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.


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