The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Dec. 07, 2011
Applicants:

Christoph Beerens, Stuttgart, DE;

Antonio Menonna, Ditzingen, DE;

Almir Zahirovic, Stuttgart, DE;

Inventors:

Christoph Beerens, Stuttgart, DE;

Antonio Menonna, Ditzingen, DE;

Almir Zahirovic, Stuttgart, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 6/40 (2006.01); B23P 11/02 (2006.01); H05B 6/44 (2006.01); H05B 6/38 (2006.01); H05B 6/42 (2006.01); F27D 11/06 (2006.01); C21D 1/42 (2006.01); H05B 6/10 (2006.01); C21D 9/30 (2006.01); H05B 6/36 (2006.01); F16B 4/00 (2006.01); F16H 53/02 (2006.01);
U.S. Cl.
CPC ...
H05B 6/40 (2013.01); B23P 11/025 (2013.01); C21D 1/42 (2013.01); C21D 9/30 (2013.01); F27D 11/06 (2013.01); H05B 6/101 (2013.01); H05B 6/365 (2013.01); H05B 6/38 (2013.01); H05B 6/42 (2013.01); H05B 6/44 (2013.01); B23P 2700/02 (2013.01); F16B 4/006 (2013.01); F16C 2226/14 (2013.01); F16H 53/025 (2013.01); Y02P 10/253 (2015.11); Y10T 29/49293 (2015.01); Y10T 29/49865 (2015.01);
Abstract

A heating device for heating a hollow component may include at least one inner induction coil and at least one outer induction coil, each configured to be heated. At least one element may be configured to influence a magnetic field formed between the inner and the outer induction coil during the operation of the heating device. The element may be arranged between the inner and the outer induction coils. Regions of the hollow component may be thinner and the thinner regions may be configured to heat more quickly than the remaining thicker regions. The thinner and thicker regions of the component may allow even heating of the component to be achieved.


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