The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Dec. 03, 2013
Applicant:

Skyworks Panasonic Filter Solutions Japan Co., Ltd., Kadoma-Shi, JP;

Inventors:

Fuyuki Abe, Kyoto-Fu, JP;

Hidenori Uematsu, Osaka-Fu, JP;

Tomohiro Fujita, Osaka-Fu, JP;

Kenichi Matsushima, Hyogo-Ken, JP;

Ichiro Kameyama, Osaka-Fu, JP;

Tetsuya Furihata, Osaka-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H01L 41/053 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03H 9/02929 (2013.01); H03H 9/1092 (2013.01);
Abstract

An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.


Find Patent Forward Citations

Loading…