The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

May. 29, 2012
Applicants:

Andreas Schlarb, Wuppertal, DE;

Bernhard Reul, Herzogenrath, DE;

Mitja Rateiczak, Wuerselen, DE;

Lothar Lesmeister, Landgraaf, NL;

Inventors:

Andreas Schlarb, Wuppertal, DE;

Bernhard Reul, Herzogenrath, DE;

Mitja Rateiczak, Wuerselen, DE;

Lothar Lesmeister, Landgraaf, NL;

Assignee:

SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/40 (2006.01); H05B 3/84 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/02 (2006.01); H01R 43/02 (2006.01); B23K 1/19 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); C22C 38/18 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/36 (2013.01); B23K 35/362 (2013.01); B23K 35/40 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 38/18 (2013.01); H01R 43/0256 (2013.01); H05B 3/84 (2013.01); B23K 2201/006 (2013.01); H05B 2203/016 (2013.01);
Abstract

A method of producing a pane having at least one electrical connection element is described. The method includes: applying soldering compound to at least one contact face of the connection element, arranging the connection element over the soldering compound on a region of an electrically conductive structure on a substrate, and connecting the connection element to the electrically conductive structure by means of the soldering compound with introduction of heat.


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