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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9425373 B1

PDFFull Text
Expired
Date of Patent:
Aug. 23, 2016

Filed:

Mar. 11, 2014

Light emitting module

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Takanori Aketa, Osaka, JP;

Yoshiharu Sanagawa, Osaka, JP;

Mitsuhiko Ueda, Osaka, JP;

Takaaki Yoshihara, Osaka, JP;

Shintaro Hayashi, Hyogo, JP;

Toshihiko Sato, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Scott B Geyer

Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/647 (2013.01); H01L 24/32 (2013.01); H01L 27/156 (2013.01); H01L 33/387 (2013.01); H01L 33/40 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 33/64 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15787 (2013.01);
Abstract

A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Find Patent Forward Citations

Aketa, Takanori. (2016). Light emitting module (U.S. Patent No. 9425373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9425373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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