The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Dec. 31, 2014
Applicant:

National Taiwan University, Taipei, TW;

Inventors:

Jian-Jang Huang, Taipei, TW;

Liang-Yu Su, Taipei, TW;

Chih-Hao Wang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/4846 (2013.01); H01L 23/49844 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 2224/48153 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device comprises a substrate, a patterned conductive layer, a first transistor structure and a second transistor structure. The patterned conductive layer is formed on the substrate. The first transistor structure includes a first source, a first gate and a first drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The second transistor structure includes a second source, a second gate and a second drain and is electrically connected to the patterned conductive layer by flip-chip bonding. The first gate is electrically connected to the second source through the patterned conductive layer, and the first source is electrically connected to the second drain through the patterned conductive layer.


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