The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Aug. 07, 2015
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Michael P. Schmidt-Lange, North Wales, PA (US);

Matthew B. Wasserman, Philadelphia, PA (US);

Christopher W. Braun, Lafayette Hill, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 37/00 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 37/04 (2006.01); B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0016 (2013.01); B23K 31/12 (2013.01); B23K 37/04 (2013.01); H01L 24/81 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/75001 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01);
Abstract

A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.


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