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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9425135 B1

PDFFull Text
Date of Patent:
Aug. 23, 2016

Filed:

Mar. 27, 2013

Electrode body, wiring substrate, and semiconductor device

Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Chihiro Migita, Tokyo, JP;

Hiroshi Kikuchi, Hidaka, JP;

Yoshiaki Takemoto, Tokyo, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Chuong A Luu

Assistant Examiner:

Rodolfo Fortich

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 24/16 (2013.01); H01L 24/83 (2013.01); H01L 2224/119 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11318 (2013.01); H01L 2224/11845 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81012 (2013.01); H01L 2224/81013 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83104 (2013.01);
Abstract

An electrode body is provided as an electrode body capable of appropriately reducing a load when silicon wafer direct bonding is performed. The electrode bodyincludes a base memberthat has a predetermined thickness; and an electrode portionthat is formed on one surface of the base member in a thickness direction thereof. The electrode portionincludes a basic bumpformed in a substantially columnar shape to protrude on the base memberand a fragile bumpformed independently from the basic bump to form a metallic bond with the basic bump

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