The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Feb. 22, 2013
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
HITACHI CHEMICAL COMPANY, LTD, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); C09J 11/06 (2006.01); C09J 201/00 (2006.01); C08L 63/00 (2006.01); C08G 59/38 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); B23K 35/02 (2006.01); C08K 5/09 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); B23K 35/0222 (2013.01); B23K 35/0233 (2013.01); B23K 35/0244 (2013.01); C08G 59/38 (2013.01); C08L 63/00 (2013.01); C09J 11/06 (2013.01); C09J 201/00 (2013.01); H01L 21/563 (2013.01); H01L 23/3157 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); B23K 2201/40 (2013.01); C08K 5/09 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01);
Abstract
A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein Rrepresents an electron-donating group.