The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Nov. 29, 2012
Robert Bosch Gmbh, Stuttgart, DE;
Fabian Bez, Kirchentelinsfurt, DE;
Johannes Duerr, Reutlingen, DE;
Rolf Becker, Pfullingen, DE;
Sven Lamers, Reutlingen, DE;
Lutz Mueller, Aichtal, DE;
Michael Schlecht, Walddorfhaeslach, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The invention relates to an electronic component () having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component () has at least one semiconductor chip () on a substrate (). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (). For encapsulation of the at least one semiconductor chip () and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (). The hermetically sealed bonding connection is a bonding wire connection () which is fully enclosed in the housing (), in which the substrate () is at least partially enclosed. The substrate () has at least one surface-mounted hydrolysis-sensitive component () in the housing ().