The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Apr. 13, 2013
Applicant:
Fujitsu Semiconductor Limited, Yokohama, JP;
Inventors:
Takumi Ihara, Yokohama, JP;
Seiji Ueno, Yokohama, JP;
Joji Fujimori, Yokohama, JP;
Yasunori Fujimoto, Yokohama, JP;
Assignee:
SOCIONEXT INC., Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/768 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76838 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1615 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor device includes: a substrate; a semiconductor element installed on the substrate so that a surface formed with an electrode is directed to the substrate; a chip capacitor installed on the substrate; and a conductive material covering a rear surface opposite to the surface of the semiconductor element and joining to one terminal electrode of the chip capacitor.