The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Jan. 13, 2011
Yoshimichi Harada, Kanagawa, JP;
Makoto Murai, Oita, JP;
Takayuki Tanaka, Oita, JP;
Kana Nagayoshi, Oita, JP;
Takuya Nakamura, Kanagawa, JP;
Yoshimichi Harada, Kanagawa, JP;
Makoto Murai, Oita, JP;
Takayuki Tanaka, Oita, JP;
Kana Nagayoshi, Oita, JP;
Takuya Nakamura, Kanagawa, JP;
SONY CORPORATION, Tokyo, JP;
Abstract
Disclosed herein is a semiconductor device, including: a mount body having a first principal surface on which a wiring pattern is formed; a semiconductor chip mounted above the principal surface of the mount body on which the wiring pattern is formed; an underfill material filled between the mount body and the semiconductor chip, thereby forming a fillet in an outer peripheral portion of the semiconductor chip; and an introduction portion formed outside a side portion, along which the fillet is formed so as to be longest, of four side portions which measure a chip mounting area, on the mount body, onto which the semiconductor chip is mounted, the introduction portion serving to introduce the underfill material between the mount body and the semiconductor chip.