The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jun. 03, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Yong Suk Kim, Suwon-Si, KR;

Sung Kwon Wi, Suwon-Si, KR;

Jeong Bok Kwak, Suwon-Si, KR;

Sang Moon Lee, Suwon-Si, KR;

Won Chul Sim, Suwon-Si, KR;

Young Seuck Yoo, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/02 (2006.01); B32B 38/04 (2006.01); H03H 7/42 (2006.01); B32B 37/24 (2006.01); H03H 1/00 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0206 (2013.01); B32B 37/24 (2013.01); B32B 38/04 (2013.01); H01F 17/0033 (2013.01); H03H 7/427 (2013.01); B32B 2037/243 (2013.01); B32B 2038/047 (2013.01); B32B 2457/00 (2013.01); H01F 17/0013 (2013.01); H01F 2017/0093 (2013.01); H03H 2001/0057 (2013.01); H03H 2001/0085 (2013.01); Y10T 156/1057 (2015.01);
Abstract

The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.


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