The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

May. 02, 2014
Applicants:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;

Inventors:

Mitsuhiro Iwata, Annaka, JP;

Masami Kobayashi, Nagoya, JP;

Koji Nakanishi, Toyota, JP;

Hiroyuki Imanishi, Toyota, JP;

Hikohito Yamazaki, Toyota, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/08 (2006.01); H01F 27/00 (2006.01); H01F 27/02 (2006.01); H01F 27/06 (2006.01); C09J 11/04 (2006.01); C09J 183/04 (2006.01); H01F 37/00 (2006.01); C09K 5/14 (2006.01); H01F 27/22 (2006.01); C09J 9/00 (2006.01); C09J 183/06 (2006.01); C09K 5/08 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
H01F 27/08 (2013.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 183/04 (2013.01); C09J 183/06 (2013.01); C09K 5/08 (2013.01); C09K 5/14 (2013.01); H01F 27/00 (2013.01); H01F 27/02 (2013.01); H01F 27/022 (2013.01); H01F 27/06 (2013.01); H01F 27/22 (2013.01); H01F 37/00 (2013.01); C08K 7/18 (2013.01);
Abstract

A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa·s at 25° C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.


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