The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Nov. 14, 2012
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Toshio Mori, Kyoto, JP;

Ikuko Aoki, Osaka, JP;

Kazuyuki Okano, Osaka, JP;

Makoto Horiuchi, Nara, JP;

Takaari Uemoto, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01); H01L 33/64 (2010.01); F21V 9/08 (2006.01); F21V 13/02 (2006.01); F21V 29/85 (2015.01); F21K 99/00 (2016.01); F21Y 101/02 (2006.01); F21V 3/04 (2006.01); F21V 23/00 (2015.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
F21V 29/24 (2013.01); F21V 9/08 (2013.01); F21V 13/02 (2013.01); F21V 29/85 (2015.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/641 (2013.01); F21K 9/135 (2013.01); F21K 9/56 (2013.01); F21V 3/0481 (2013.01); F21V 23/002 (2013.01); F21Y 2101/02 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83951 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting module includes a substrate, an LED chip arranged on a main surface of the substrate, a sealing member covering the LED chip on the main surface of the substrate and converting a wavelength of the light produced by the LED chip, and a heat transfer member thermally connecting the sides of the LED chip to the main surface of the substrate and dissipating heat produced by the LED chip to the substrate. The heat transfer member is made up of a silicone resin having particles dispersed therein, the particles being nanoparticles of ZrOand microparticles of MgO, which have higher thermal conductivity than the silicone resin.


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