The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Oct. 11, 2012
Applicant:

Hirokazu Terada, Shiga, JP;

Inventor:

Hirokazu Terada, Shiga, JP;

Assignees:

JNC CORPORATION, Tokyo, JP;

JNC FIBERS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 3/30 (2006.01); B32B 5/04 (2006.01); B32B 5/26 (2006.01); B32B 7/04 (2006.01); B32B 7/08 (2006.01); B32B 37/14 (2006.01); B32B 37/30 (2006.01); D04H 1/50 (2012.01); D04H 1/555 (2012.01); D04H 1/541 (2012.01); B32B 5/02 (2006.01); D04H 1/498 (2012.01); D04H 1/4374 (2012.01); B32B 3/28 (2006.01); B32B 5/08 (2006.01); B32B 3/26 (2006.01); B32B 37/10 (2006.01); B32B 37/00 (2006.01); B32B 7/02 (2006.01);
U.S. Cl.
CPC ...
D04H 1/541 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 7/045 (2013.01); D04H 1/4374 (2013.01); D04H 1/498 (2013.01); D04H 1/50 (2013.01); D04H 1/555 (2013.01); B32B 3/263 (2013.01); B32B 3/266 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 5/04 (2013.01); B32B 5/08 (2013.01); B32B 7/02 (2013.01); B32B 7/08 (2013.01); B32B 37/0076 (2013.01); B32B 37/1045 (2013.01); B32B 37/144 (2013.01); B32B 37/30 (2013.01); B32B 2250/02 (2013.01); B32B 2250/20 (2013.01); Y10T 428/24322 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24661 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/249922 (2015.04);
Abstract

To provide a stretchable bulky nonwoven fabric having a high bulkiness and a good feeling; wherein a first fibrous layer including fibers () is laminated with a second fibrous layer including heat fusible fibers () and having a MD shrinkage ratio lower by 5% or more than a MD shrinkage ratio of the first fibrous layer, the first fibrous layer and the second fibrous layer are integrated by entanglement between the fibers () included in the first fibrous layer and fibers () included in the second fibrous layer, the first fibrous layer is shrunk to form a structure in which the second layer is raised in the thickness direction, and sonic bond processing is applied from a side of the second fibrous layer.


Find Patent Forward Citations

Loading…