The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Sep. 22, 2011
Applicants:

Li-chih Yu, Tao-Yuan Hsien, TW;

Tse-an Lee, Tao-Yuan Hsien, TW;

Inventors:

Li-Chih Yu, Tao-Yuan Hsien, TW;

Tse-An Lee, Tao-Yuan Hsien, TW;

Assignee:

ELITE MATERIAL CO., LTD., Tao-Yuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 (2006.01); C08K 5/5399 (2006.01); C08K 3/36 (2006.01); C08K 5/09 (2006.01); C08L 79/04 (2006.01); H05K 1/03 (2006.01); H05K 3/22 (2006.01); C08L 35/06 (2006.01); C08K 3/26 (2006.01); C08G 73/06 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08K 3/0033 (2013.01); C08G 73/0655 (2013.01); C08K 3/26 (2013.01); C08K 3/36 (2013.01); C08K 5/09 (2013.01); C08K 5/5399 (2013.01); C08L 35/06 (2013.01); C08L 79/04 (2013.01); H05K 1/0353 (2013.01); H05K 3/022 (2013.01); H05K 2201/012 (2013.01); Y10T 428/31692 (2015.04);
Abstract

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.


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